Product Introduction：
Through integrated image acquisition, processing, and computational analysis, this system performs real-time inspection, operate and application, effectively eliminating measurement inaccuracies caused by variable operating conditions and human judgment.
Furthermore, the advanced technology enables faster and more precise identification of both internal and external defects, ensuring timely inspection of process anomalies while guaranteeing only certified modules proceed downstream, thereby achieving labor cost optimization.
Product Parameters：
Process Pre-lamination Rework / Post-lamination Cleaning
Device Functions Module EL/PL Inspection, Module Appearance Inspection
Inspection Items EL inspection: broken grid, black center, black edge, hidden crack, short circuit, cell efficiency, false soldering, etc. Appearance: string spacing, slice spacing, sink bar welding abnormality, welding tape abnormality, square array offset,
cell debris scratches and other defects
Cell Specifications PERC, HJT, TOCon, Calcitonite, 0BB
Module Specifications Module Size: 1650-2550*900-1450
AI Judgment Indicators Before Lamination: Missed inspections rate < 0.2%; Misjudge rate < 5%
After Lamination: Missed inspections rate < 0.1%; Misjudge rate < 3%
* The parameters are for reference only, do not constitute a basis for an offer, and the actual product shall prevail.
